S. Thomas

Industry trends in photonics packaging: Passive fiber and die coupling

M. Anselm, S. Thomas, Keyla Y. Bastardo, 2017, 2017 Pan Pacific Microelectronics Symposium (Pan Pacific).

Emerging Materials Challenges in Microelectronics Packaging

D. Frear, S. Thomas, 2003 .

Development of an Adaptronic Spindle for a Faultless Machining of Homogeneous and Inhomogeneous Materials

S. Thomas, Dobrinski Alexander, Möhring Hans-Christian, 2021 .