Guy Vereecke

发表

Experimental investigation of fabrication process-, transportation-, storage, and handling-induced contamination of 157-nm reticles and vacuum UV cleaning

Kurt G. Ronse, Michael Kocsis, Young-Seog Kang, 2004, SPIE Advanced Lithography.

Surface preparation and cleaning in back-end-of-line for advanced CMOS integrated circuit

Stefan De Gendt, Guy Vereecke, Frank Holsteyns, 2013 .

Investigating the role of gas cavitation in megasonic nanoparticle removal

Els Parton, M. Schmidt, Guy Vereecke, 2004, MICRO 2004.

Developments in cleaning technology for critical layers

Stefan De Gendt, Marc Heyns, Marc Meuris, 2000 .

Evaluation of Megasonic Cleaning for Sub-90nm Technologies

Guy Vereecke, Karine Kenis, Frank Holsteyns, 2005 .

Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora\textregistered LK HM

David De Roest, Nancy Heylen, Herbert Struyf, 2010 .

The IMEC clean : A new concept for particle and metal removal on Si surfaces

Marc Heyns, Marc Meuris, Guy Vereecke, 1995 .

Megasonics: A Cavitation Driven Process

Guy Vereecke, Frank Holsteyns, Paul Mertens, 2005 .

Relation between Particle Density and Haze on a Wafer: a New Approach to Measuring Nano-Sized Particles

Marc Heyns, Guy Vereecke, Karine Kenis, 2003 .

Hydrogen outgassing induced liner/barrier reliability degradation in through silicon via's

Eric Beyne, Ingrid De Wolf, Stefaan Van Huylenbroeck, 2014 .