James M. Loman
发表
Wei Huang,
James M. Loman,
Thomas Song,
2015,
Reliab. Eng. Syst. Saf..
Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability
Wei Huang,
James M. Loman,
Bülent Sener,
2002,
Microelectron. Reliab..