J. Varghese

A Qualitative Understanding of Interfacial Failure During Flexural Loading of Printed Wiring Assemblies

A. Dasgupta, J. Varghese, 2006 .

A Technique to Characterize Rate-Dependent Failure Envelopes in Surface Mount Assemblies

A. Dasgupta, J. Varghese, 2006 .

The Role of Aging on Dynamic Failure Envelopes of OSP-Sn37Pb Interconnects in Plastic Ball Grid Array (PBGA) Packages

M. Pecht, M. Azarian, A. Dasgupta, 2009, IEEE Transactions on Components and Packaging Technologies.

Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices

Koustav Sinha, Joe Varghese, Abhijit Dasgupta, 2014, Microelectron. Reliab..

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Michael Pecht, Abhijit Dasgupta, Michael H. Azarian, 2005 .

Hybrid experimental and computational approach for rate dependent mechanical properties using indentation techniques

D. Herkommer, A. Dasgupta, J. Varghese, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Approach to Fabricate Rigid Substrate for 2.4 GHz Inverted-F Antenna Using a Room Temperature Curable Dielectric Ink on Photo and Nanopaper

H. Liimatainen, H. Jantunen, M. Sebastian, 2018, Journal of Electronic Materials.

An experimental approach to characterize rate-dependent failure envelopes and failure site transitions in surface mount assemblies

A. Dasgupta, J. Varghese, A. Dasgupta, 2007, Microelectron. Reliab..