Hirokazu Ito

Low-Cost 1- $\mu$ m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL

Fuhan Liu, Chandrasekharan Nair, Rao R. Tummala, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

High-density low-loss millimeter-wave package interconnects with the impact of dielectric-material surface roughness

R. Tummala, M. Swaminathan, Hirokazu Ito, 2021, Applied Physics Letters.

Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages

Madhavan Swaminathan, Rao R. Tummala, Hirokazu Ito, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Advanced Low-Loss Photo-imageable Dielectric Material for RF/Millimeter-Wave Applications and Demonstration of High-Density Interconnect

M. Swaminathan, Hirokazu Ito, Koichi Hasegawa, 2021, Electronic Components and Technology Conference.

Advanced Low-Loss and High-Density Photosensitive Dielectric Material for RF/Millimeter-Wave Applications

Rao R. Tummala, Hirokazu Ito, R. Tummala, 2019, 2019 International Wafer Level Packaging Conference (IWLPC).