B. Karunamurthy

Erosion and rolling contact wear mechanisms in silicon nitride hybrid bearings

B. Karunamurthy, 2009 .

Cavitation erosion in silicon nitride: Experimental investigations on the mechanism of material degradation

M. Hadfield, C. Vieillard, B. Karunamurthy, 2010 .

Cavitation and rolling wear in silicon nitride

Z. Khan, G. Morales-Espejel, M. Hadfield, 2010 .

FEM Study of Fatigue Crack Growth in a Power Semiconductor Chip Subjected to Transient Thermal Loading

H. Pettermann, G. Kravchenko, B. Karunamurthy, 2014 .

Characterization and modeling of the AuCuSn thin solder joint under thermal cycling

T. Antretter, B. Karunamurthy, Tiphaine Pélisset, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Thermomechanical fatigue damage modeling and material parameter calibration for thin film metallizations

M. Nelhiebel, H. Pettermann, P. Hoffmann, 2021, International Journal of Fatigue.

Constitutive modeling of thin films under thermal cycling

T. Antretter, W. Heinz, B. Karunamurthy, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

Epitaxial Volmer-Weber growth modelling

T. Grasser, H. Ceric, R. Coppeta, 2013, 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD).

A novel simulation methodology for full chip-package thermo-mechanical reliability investigations

Balamurugan Karunamurthy, Thomas Ostermann, Monojit Bhattacharya, 2014, Microelectron. J..

Multiphysical modeling of nanosecond laser dicing on ultra-thin silicon wafers

B. Karunamurthy, G. Galasso, H. Eder, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).