S.K.W. Seah
发表
Chwee Teck Lim,
C. W. Ang,
L. B. Tan,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
E.H. Wong,
R. Rajoo,
C.T. Lim,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Xiaowu Zhang,
Chwee Teck Lim,
V.B.C. Tan,
2003,
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
Vincent B. C. Tan,
V.P.W. Shim,
Chwee Teck Lim,
2002,
4th Electronics Packaging Technology Conference, 2002..
Chwee Teck Lim,
S.K.W. Seah,
Vincent B. C. Tan,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
E.H. Wong,
R. Rajoo,
C.T. Lim,
2006,
56th Electronic Components and Technology Conference 2006.
E.H. Wong,
W.D. van Driel,
J.F.J.M. Caers,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Yi-Shao Lai,
N. Owens,
Ranjan Rajoo,
2009
.
Yi-Shao Lai,
E.H. Wong,
W.D. van Driel,
2008,
2008 58th Electronic Components and Technology Conference.
V.P.W. Shim,
S.K.W. Seah,
V. Shim,
2008
.
Yi-Shao Lai,
N. Owens,
D. R. Frear,
2008
.
Yi-Shao Lai,
N. Owens,
D. R. Frear,
2008
.
E.H. Wong,
R. Rajoo,
S.K.W. Seah,
2006,
56th Electronic Components and Technology Conference 2006.
E.H. Wong,
R. Rajoo,
S.K.W. Seah,
2006,
56th Electronic Components and Technology Conference 2006.
K. Vaidyanathan,
S.K.W. Seah,
C. Selvanayagam,
2008,
2008 58th Electronic Components and Technology Conference.
E.H. Wong,
N. Owens,
S.K.W. Seah,
2008,
2008 10th Electronics Packaging Technology Conference.
E.H. Wong,
S.K.W. Seah,
D. Cadge,
2008,
2008 58th Electronic Components and Technology Conference.