T. Tabira

Further Enhancement of Electro-migration Resistance by Combination of Self-aligned Barrier and Copper Wiring Encapsulation Techniques for 32-nm Nodes and Beyond

T. Suzuki, T. Sugii, H. Kitada, 2008, 2008 International Interconnect Technology Conference.

Ultrathin Barrier Formation Using Combination of Manganese Oxide Encapsulation and Self-Aligned Copper Silicon Nitride Barriers for Copper Wiring in Future LSI Interconnects

Y. Nara, H. Kitada, T. Owada, 2011, IEEE Transactions on Electron Devices.

The influence of the size effect of copper interconnects on RC delay variability beyond 45nm technology

H. Kitada, T. Nakamura, N. Ohtsuka, 2007, 2007 IEEE International Interconnect Technology Conferencee.