B. Zhou
发表
Y. Yang,
Hui Zheng,
Q. M. Zhang,
2011
.
Yezhou Yang,
Mingxia Wu,
Gang Yang,
2022,
Manufacturing Review.
E. Han,
Rongshi Chen,
D. Wu,
2019,
Materials Characterization.
E. Han,
R. S. Chen,
D. Wu,
2019,
Journal of Materials Science & Technology.
Xingtai Zhou,
Fuzhou Han,
Hefei Huang,
2016
.
Z. Zhang,
Z. Zhang,
T. Jin,
2014
.
Electromigration Effect on Kinetics of Cu–Sn Intermetallic Compound Growth in Lead-Free Solder Joint
R. Yao,
X. P. Li,
Z. Fu,
2017,
IEEE Transactions on Device and Materials Reliability.