M. Renavikar
发表
M. Renavikar,
2003
.
R. Mahajan,
I. Dutta,
J. Pang,
2010,
2010 12th Electronics Packaging Technology Conference.
R. Mahajan,
R. Raj,
Praveen Kumar,
2011
.
R. S. Sidhu,
Nikhilesh Chawla,
N. Chawla,
2006
.
R. Raj,
J. Liu,
I. Dutta,
2009,
2009 11th Electronics Packaging Technology Conference.
J. Liu,
I. Dutta,
R. Raj,
2009,
2008 Second International Conference on Thermal Issues in Emerging Technologies.
R. Mahajan,
I. Dutta,
Z. Huang,
2014,
Journal of Electronic Materials.
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates:
I. Effects of Loading and Processing Conditions
R. Mahajan,
J. Pang,
I. Dutta,
2012,
Journal of Electronic Materials.
R. Mahajan,
I. Dutta,
Z. Huang,
2012,
Journal of Electronic Materials.
V. Sarihan,
D. Frear,
I. Dutta,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
S. Walwadkar,
Olivia H. Chen,
S. Mokler,
2016
.
P. Diglio,
P. Tadayon,
S. Wozny,
2021,
Materialia.
Shubhada Sahasrabudhe,
Scott Mokler,
Mukul Renavikar,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Mukul Renavikar,
M. Renavikar,
2008
.
C. Gurumurthy,
Mukul P. Renavikar,
Charan K. Gurumurthy,
2008
.
R. Mahajan,
R. Raj,
I. Dutta,
2014,
Journal of Materials Science.
R. Mahajan,
Praveen Kumar,
I. Dutta,
2009
.