X. Ma

发表

Influence of metal-oxide/salt content in the aluminum soldering flux on solderability and corrosion resistance of Sn-0.7Cu/6061Al joints

Min-bo Zhou, Xin-Ping Zhang, Li Zhou, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints

Min-bo Zhou, Xin-Ping Zhang, X. Ma, 2012, Journal of Electronic Materials.

The influence of standoff height and pad size on the Shear fracture behavior of BGA structured Cu/Sn3.0Ag0.5Cu/Cu interconnects

Min-bo Zhou, Xin-Ping Zhang, J. Xia, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Optimization of Automated Crystal Orientation Mapping in a TEM for Ni4Ti3 Precipitation in All-Round SMA

D. Schryvers, B. Amin-ahmadi, Xin-Ping Zhang, 2016, Shape Memory and Superelasticity.

Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process

Fang Ma, Min-bo Zhou, Xin-Ping Zhang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Effect of activators and surfactants in halogen-free fluxes on wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate

Xin-Ping Zhang, X. Ma, M. Zhou, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Fine-Grained Bulk NiTi Shape Memory Alloy Fabricated by Rapid Solidification Process and Its Mechanical Properties and Damping Performance

C. Ke, S. Cao, Xin-Ping Zhang, 2013 .

The Twinning Modes of B2-B19′ Martensitic Transformation in NiTi Alloys - A Phase Field Study

C. Ke, Xin Ping Zhang, S. Cao, 2011 .

Martensitic interfaces and transformation crystallography in Pu–Ga alloys

R. Pond, X. Ma, 2011 .

Effect of isothermal aging on mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy

Xin-Ping Zhang, X. Ma, Can Yin, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Phase transformation and damping behavior of lightweight porous TiNiCu alloys fabricated by powder metallurgy process

C. Ke, Xin-Ping Zhang, S. Cao, 2013 .

Investigation on combustion of fire retardant board under different N2–O2 mixture gas atmospheres by using thermogravimetric analysis

Chao Feng, X. Ma, F. Tan, 2011 .

Experimental and kinetic modeling of oxygen-enriched air combustion of municipal solid waste.

Zhaosheng Yu, Guo Hui Liu, Zhaosheng Yu, 2009, Waste management.

Influence of pre-existing void in the solder joint on electromigration behavior of Cu/Sn58Bi/Cu joints

H. Qin, W. Yue, Xin-Ping Zhang, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints

H. Qin, W. Yue, Xin-Ping Zhang, 2012 .

Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing

H. Qin, W. Yue, Min-bo Zhou, 2014 .

Influence of soldering temperature and dwelling time on morphological evolution of Cu 6 Sn 5 intermetallic compound at the Sn-3.0Ag-0.5Cu/Cu interface

S. Cao, Xin-Ping Zhang, Jing-Bo Zeng, 2012 .

Dissolution behavior of Cu UBM in BGA structure Sn-3.0Ag-0.5Cu/Cu joints during liquid isothermal aging at and above the solder's melting temperature

Xin-Ping Zhang, Jing-Bo Zeng, X. Ma, 2012 .

Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System

Min-bo Zhou, Xin-Ping Zhang, X. Ma, 2011 .

Interfacial reaction and melting/solidification characteristics between Sn and different metallizations of Cu, Ag, Ni and Co

H. Qin, Xin-Ping Zhang, X. Ma, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Nano-sized SiC particle reinforced NiTi alloy matrix shape memory composite

C. Ke, X. Zhang, S. Cao, 2013 .

Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly of LED lighting components

Xin-Ping Zhang, Lang Zhang, Fu-Shun Qiu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

W. Le, C. Ke, S. Liang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Experimental and numerical study of the size effect on microstructure and mechanical behavior of Cu/Sn0.7Cu0.05Ni/Cu joints with very small solder volume

H. Qin, Xin-Ping Zhang, Wei Li, 2012 .

Design, fabrication and characterization of porous Ti-rich Ti-Ni alloy based composites with near-zero thermal expansion behavior

Junping Luo, Xin-Ping Zhang, S. Cao, 2015 .

Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures

Xin-Ping Zhang, X. Ma, M. Zhou, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements

Xin-Ping Zhang, X. Ma, Jia-Qiang Huang, 2012 .

Anisotropic Negative Thermal Expansion Behavior of the As-Fabricated Ti-Rich and Equiatomic Ti–Ni Alloys Induced by Preferential Grain Orientation

C. Ke, Xin-Ping Zhang, S. Cao, 2018, Shape Memory and Superelasticity.

The energy consumption and environmental impacts of a color TV set in China

Xiao Qian Ma, Chao Feng, Chao Feng, 2009 .

Fabrication of Flexible Printed Circuits on Polyimide Substrate by Using Ag Nanoparticle Ink through 3D Direct-writing and Reliability of the Printed Circuits

Xin-Ping Zhang, X. Ma, M. Zhou, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

A fast and general approach to produce a carbon coated Janus metal/oxide hybrid for catalytic water splitting

Yan Liu, Huijun Wu, Haitao Huang, 2021 .

Rapidly solidified and optimally constraint-aged Ni51Ti49 shape memory alloy aiming at making a purpose-designed bio-actuator

Youpeng Li, Y. Y. Li, C. Ke, 2017 .

Tin nanoparticles modified nano-silver paste for pressureless low-temperature sintering process

Min-bo Zhou, Xin-Ping Zhang, X. Ma, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

A criterion for determining the optimum value of twist in the topological model

Xin-Ping Zhang, X. Ma, Zhaozhao Wei, 2014 .

Defect Structure and Martensitic Transformation Crystallography in Ni2MnGa Alloy

X. Ma, X. Zhang, Zhaozhao Wei, 2011 .

Experimental and kinetic modeling of oxygen-enriched air combustion of paper mill sludge.

H. Xiao, Kai Liu, X. Ma, 2010, Waste management.

An abnormal two-way shape memory effect in a rapidly solidified Ni51Ti49 alloy induced by low temperature constrained aging

Youpeng Li, X. Zhang, X. Yao, 2018 .

Influence of strongly textured microstructure on the all-round shape memory effect of rapidly solidified Ni51Ti49 alloy

Youpeng Li, Y. Y. Li, C. Ke, 2017 .

PHASE FIELD SIMULATION OF GROWTH KINETICS OF COHERENT Ni 4 Ti 3 PRECIPITATE IN NiTi SHAPE MEMORY ALLOY: PHASE FIELD SIMULATION OF GROWTH KINETICS OF COHERENT Ni 4 Ti 3 PRECIPITATE IN NiTi SHAPE MEMORY ALLOY

C. Ke, Xin-Ping Zhang, X. Ma, 2010 .

Modeling of Ni4Ti3 precipitation during stress-free and stress-assisted aging of bi-crystalline NiTi shape memory alloys

C. Ke, Xin-Ping Zhang, S. Cao, 2012 .

Phase Field Simulation of Ni4Ti3 Precipitation in Porous NiTi Shape Memory Alloys under Applied Stresses

C. Ke, Xin Ping Zhang, X. Ma, 2010 .

Thermal Cycling Induced Instability of Martensitic Transformation and the Micro-Mechanism in Solution-Treated Ni 51 Ti 49 Alloy

Xin-Ping Zhang, L. Yuanyuan, S. Cao, 2018 .