C. D. da Cruz

Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness

N. Cheung, Amauri Garcia, Thiago S Lima, 2019, Materials Research Express.

Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses

N. Cheung, Thiago S Lima, J. Spinelli, 2019, Metals.