G. Ban

Effect of Cu, Ag on the microstructure and IMC evolution of Sn5Sb–CuAgNi/Cu solder joints

F. Sun, Yang Liu, Tianhui Li, 2019, Materials Research Express.

Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes

Jiajie Fan, F. Sun, Yang Liu, 2017 .

Influence of Cu Nanoparticles on Microstructure and Mechanical Properties of Sn0.7Ag0.5Cu-BiNi/Cu Solder Joint

F. Sun, J. Fan, G. Ban, 2017, Journal of Materials Engineering and Performance.