Jong-Kai Lin

Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis

Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin, 2016, Microelectron. Reliab..

Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)

Jong-Kai Lin, Roshan Weerasekera, Songbai Zhang, 2015, IEEE Design & Test.

Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing

Jong-Kai Lin, D. R. Frear, Jin-Wook Jang, 2004 .

Mechanical tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Jong-Kai Lin, A. De Silva, Jin-Wook Jang, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Failure Morphology After Drop Impact Test of Ball Grid Array (BGA) Package With Lead-Free Sn–3.8Ag–0.7Cu and Eutectic SnPb Solders

Jong-Kai Lin, N.L. Owens, Jin-Wook Jang, 2007, IEEE Transactions on Electronics Packaging Manufacturing.

Electromigration studies of lead-free solder balls used for wafer-level packaging

Jong-Kai Lin, Christine Hau-Riege, You-Wen Yau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Mitigation of warpage for large 2.5D Through Silicon Interposer (TSI) package assembly

Jong-Kai Lin, Vempati Srinivasa Rao, Mian Zhi Ding, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Characterization of lead-free solders and under bump metallurgies for flip-chip package

Li Li, Jong-Kai Lin, Yifan Guo, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy

Jong-Kai Lin, D. R. Frear, Jin-Wook Jang, 2005 .

Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Jong-Kai Lin, D. R. Frear, Jin-Wook Jang, 2004 .