M. DeSilva

发表

Simulation of Electroless Deposition of Cu Thin Films for Very Large Scale Integration Metallization

Tom J. Smy, Michael J. Brett, Steven K. Dew, 1997 .

High Aspect Ratio Microtunnel Technique to Empirically Model Electroless Deposition

Y. Shacham-Diamand, Hansu Kim, R. Soave, 1996 .

The adhesion of metallic films to laser‐irradiated alumina

D. Lowndes, A. J. Pedraza, M. DeSilva, 1995 .

Laser-Induced Surface Activation of Aluminum Oxide for Electroless Deposition

D. Lowndes, A. J. Pedraza, M. DeSilva, 1992 .

Ablation, Melting, and Smoothing of Polycrystalline Alumina by Pulsed Excimer Laser Radiation

D. Geohegan, D. Lowndes, A. J. Pedraza, 1992 .

Electroless copper films deposited onto laser-activated aluminum nitride and alumina

D. Lowndes, A. J. Pedraza, D. H. Lowndes, 1994 .

A Novel Seed Layer Scheme to Protect Catalytic Surfaces for Electroless Deposition

Y. Shacham-Diamand, M. DeSilva, 1996 .

Smooth polycrystalline ceramic substrates with enhanced metal adhesion by pulsed excimer laser processing

T. Thundat, D. Lowndes, R. Warmack, 1994 .