Andreas Schiessl

Virtual qualification - The step into a new period of automotive electronic development

Andreas Bernhardt, Andreas Schiessl, Angelika Schingale, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading

Andreas Schiessl, Mike Roellig, Karsten Meier, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).