M. Volpert

Development of a wafer level packaging technology for high voltage applications

T. Lacave, B. Chambion, A. Vandeneynde, 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC).

Further insight into interfacial interactions in nickel/liquid Sn–Ag solder system at 230–350 °C

F. Hodaj, M. Volpert, D. Taneja, 2017, Journal of Materials Science: Materials in Electronics.

Understanding the Behavior of SnAg Bumps at 10 µm Pitch and Below for Imaging and Microdisplay Application

D. Henry, F. Hodaj, G. Lasfargues, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

A Wafer Level approach for led packaging using TSV last technology

D. Henry, S. Gaugiran, S. Borel, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

On the initial stages of solid state reactions in Ni/Sn-Ag solder system at 150–210 °C

F. Hodaj, M. Volpert, D. Taneja, 2018 .

Towards reliable pitch assembly using Cu/Ni/SnAg based interconnects

D. Henry, F. Hodaj, L. Mendizábal, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

Chip-to-chip optical interconnections between stacked self-aligned SOI photonic chips.

Julie Harduin, Jean-Marc Fédéli, Christophe Kopp, 2012, Optics express.

Indium deposition processes for ultra fine pitch 3D interconnections

H. Ribot, S. Pocas, M. Volpert, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

A fluxless bonding process using AuSn or Indium for a miniaturized hermetic package

Stephane Bernabe, Christophe Kopp, Adrien Gasse, 2009, 2009 59th Electronic Components and Technology Conference.

High-efficiency and Wideband Interlayer Grating Couplers in Multilayer Si/sio 2 /sin Platform for 3d Integration of Optical Functionalities References and Links

Ali Adibi, Ali A Eftekhar, Reza Pourabolghasem, 2022 .