T. Sakurai

1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme

D.D. Antono, H. Kawaguchi, K. Ishida, 2003, 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC..

A 0.5V, 400MHz, V/sub 00/-hopping processor with zero-V/sub TH/ FD-SOI technology

H. Kawaguchi, K. Kanda, T. Miyazaki, 2003, 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC..

A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme

T. Sakurai, N. Miura, T. Kuroda, 2005, ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005..

Analysis and design of transceiver circuit and inductor layout for inductive inter-chip wireless superconnect

T. Sakurai, N. Miura, T. Kuroda, 2004, 2004 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No.04CH37525).

Application of secondary ion mass spectrometry (SIMS) for the analysis of asbestos fibers

T. Sakurai, M. Sōma, Y. Soma, 1991 .