K. Yoshikawa

Development of Cu-less TSV reveal process using Si/Cu grinding, electroless Ni plating, and alkaline etching of Si

Masahiro Aoyagi, Naoya Watanabe, Eiichi Yamamoto, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

Silicon wafer thinning and backside via exposure by wet etching

N. Watanabe, M. Aoyagi, K. Yoshikawa, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Immersion-Specific Defects of High-Receding-Angle Topcoat

T. Hanawa, K. Okada, T. Ando, 2010 .

Surface Segregation Analysis of Hydrophobic Additive of Non-topcoat Resist

Naoko Shirota, Osamu Yokokoji, Takuya Hagiwara, 2008 .

Evaluation of SiO2 Films and SiO2/Si Interfaces by Graded Etching

Y. Nakagawa, M. Nakamura, K. Yoshikawa, 2002 .

Evaluation of Acoustic- and Flow-Induced Vibration of the BWR Main Steam Lines and Dryer

Ryo Morita, Fumio Inada, Kazuhiro Yoshikawa, 2011 .

Computational Investigation of Pressure Fluctuations in BWR Main Steam Line

Shirō Takahashi, F. Inada, R. Morita, 2009 .

Development of BWR Steam Dryer Loading Evaluation Methods Through Scale Model Tests Under Actual Steam Conditions

Shirō Takahashi, A. Tamura, Keita Okuyama, 2013 .

Experimental Study of Acoustic and Flow-Induced Vibrations in BWR Main Steam Lines and Steam Dryers

Shiro Takahashi, Ito Takashi, Kazuhiro Yoshikawa, 2008 .

Mechanism of immersion specific defects with high receding-angle topcoat

Takuya Hagiwara, Kazuyuki Okada, Kazuhiro Yoshikawa, 2007, SPIE Advanced Lithography.