A. Saboui

The importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

C. Lyden, J. Barrett, H. Pape, 1995 .

Thin type packaging: an effective way to improve the popcorn resistance of plastic-packaged ICs

A. Saboui, K. van Doorselaer, A. Hente, 1993, 31st Annual Proceedings Reliability Physics 1993.

The importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

C. Lyden, J. Barrett, W. Lawton, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Accurate prediction of PQFP warpage

C. Lyden, J. Barrett, G. Kelly, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.