Peng-Fei Fu

Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits

Sheng Wang, Yann Civale, Herman Meynen, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

High-resolution functional epoxysilsesquioxane-based patterning layers for large-area nanoimprinting.

Carlos Pina-Hernandez, Peng-Fei Fu, L Jay Guo, 2010, ACS nano.

High‐Throughput and Etch‐Selective Nanoimprinting and Stamping Based on Fast‐ Thermal‐Curing Poly(dimethylsiloxane)s

Carlos Pina-Hernandez, Peng-Fei Fu, L. J. Guo, 2007 .

Low cost, room temperature debondable spin-on temporary bonding solution: A key enabler for 2.5D/3D IC packaging

Herman Meynen, Peng-Fei Fu, Peng-Fei Fu, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.