A. Jackson

Correlation of silver migration with temperature-humidity-bias (THB) failures in multilayer ceramic capacitors

H. Ling, A. Jackson, 1989 .

Evaluation of Lead- Free Solder Joints in Electronic Assemblies

P. Vianco, I. Artaki, A. Jackson, 1994 .

Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

P. Vianco, J. Rejent, U. Ray, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Assembly feasibility and reliability studies of surface mount circuit boards manufactured with lead-free solders

P. Vianco, I. Artaki, A. Jackson, 1994 .

An Evaluation of Effects of Molding Compound Properties on the Reliability of Ag Wire Bonded Components

C. Handwerker, P. Su, M. Parsons, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).