S. Seo

发表

Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

Sung K. Kang, Hyuck-Mo Lee, S. Seo, 2010 .

Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders

Hyuck-Mo Lee, D. Shih, S. Kang, 2008, 2008 58th Electronic Components and Technology Conference.

Dependence of the InAs size distribution on the stacked layer number for vertically stacked InAs/GaAs quantum dots

J. Lee, H. Lee, J. Shin, 2002 .

Microstructure and strength of rapidly solidified and extruded Mg-Zn alloys

Jong-Hyeon Lee, B. Chun, Taek-Soo Kim, 2000 .

The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

Da-Yuan Shih, Sun-Kyoung Seo, Sung K. Kang, 2009 .

Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Sung K. Kang, Hyuck-Mo Lee, D. Shih, 2009 .

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

Da-Yuan Shih, Sun-Kyoung Seo, Sung K. Kang, 2009 .

Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders

Dong Nyung Lee, Hyuck-Mo Lee, Jaewon Chang, 2012 .

Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System

Sun-Kyoung Seo, Hyuck-Mo Lee, Hyuck Mo Lee, 2007 .

Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies

Hyuck-Mo Lee, S. Seo, M. Cho, 2009 .

Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Hyuck-Mo Lee, W. Choi, S. Seo, 2006 .

Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM

Hyuck-Mo Lee, S. Seo, M. Cho, 2008 .

Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures

Sun-Kyoung Seo, Hyuck-Mo Lee, Hyuck Mo Lee, 2009 .

Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging

Sung K. Kang, Hyuck-Mo Lee, D. Shih, 2009 .

Wettability and interfacial reactions of Sn-based Pb-free solders with Cu–xZn alloy under bump metallurgies

Hyuck-Mo Lee, S. Seo, M. Cho, 2009 .

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

Jaewon Chang, Sun-Kyoung Seo, Hyuck-Mo Lee, 2010 .

The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging

Hyuck Mo Lee, Da-Yuan Shih, Sun-Kyoung Seo, 2009, Microelectron. Reliab..

Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders

Sung K. Kang, Hyuck-Mo Lee, Jaewon Chang, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Effect of Ag Addition on the Ripening Growth of ${\rm Cu}_{6}{\rm Sn}_{5}$ Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

Kyung-Wook Paik, Sun-Kyoung Seo, Hyuck-Mo Lee, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effect of Ag on ripening growth of Cu6Sn5 grains formed between molten Sn-xAg-0.5Cu solders and Cu

Hyuck-Mo Lee, K. Paik, Y. Park, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging

Hyuck-Mo Lee, Dong Chun Lee, Y. Jo, 2008 .

Process and Design Optimization for Hybrid Cu Bonding Void

Dae-woo Kim, S. Seo, Yeongseon Kim, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

A study on bonding pad structure and layout for Fine pitch hybrid bonding

Dae-woo Kim, S. Seo, Yeongseon Kim, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

The effects of Ag, Cu compositions and Zn doping on the electromigration performance of Pb-free solders

Sung K. Kang, C. Goldsmith, D. Shih, 2009, Electronic Components and Technology Conference.

Low temperature Cu-Cu bonding using Ag nanoparticles by PVD

Jian Cai, Ziyu Liu, Zijian Wu, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints

Sun-Kyoung Seo, Hyuck-Mo Lee, Hyuck Mo Lee, 2010 .

The Microstructure and Crystal Orientation of SnAg and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni ( P )

Sung K. Kang, Hyuck-Mo Lee, D. Shih, 2009 .

CoW Package Solution for Improving Thermal Characteristic of TSV-SiP for AI-Inference

S. Seo, Mina Choi, Taehwan Kim, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applications

Dae-woo Kim, S. Seo, Yeongseon Kim, 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).