M. Cho

发表

Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

Sung K. Kang, Hyuck-Mo Lee, S. Seo, 2010 .

Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders

Hyuck-Mo Lee, D. Shih, S. Kang, 2008, 2008 58th Electronic Components and Technology Conference.

Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM

D. W. Henderson, R. Polastre, C. Goldsmith, 2008, 2008 58th Electronic Components and Technology Conference.

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process

Paul A. Lauro, Da-Yuan Shih, Sung K. Kang, 2007 .

The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

Da-Yuan Shih, Sun-Kyoung Seo, Sung K. Kang, 2009 .

Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Sung K. Kang, Hyuck-Mo Lee, D. Shih, 2009 .

Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging

Hyuck-Mo Lee, K. Paik, S. Booh, 2006 .

Effects of Minor Additions of Zn on Interfacial Reactions of Sn-Ag-Cu and Sn-Cu Solders with Various Cu Substrates during Thermal Aging

Da-Yuan Shih, Sung K. Kang, Hyuck-Mo Lee, 2007 .

Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs

K. Paik, M. Cho, Young-Doo Jeon, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders

Dong Nyung Lee, Hyuck-Mo Lee, Jaewon Chang, 2012 .

Thermodynamic Assessment of the Ni-Bi Binary System and Phase Equilibria of the Sn-Bi-Ni Ternary System

Sun-Kyoung Seo, Hyuck-Mo Lee, Hyuck Mo Lee, 2007 .

Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies

Hyuck-Mo Lee, S. Seo, M. Cho, 2009 .

Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Hyuck-Mo Lee, W. Choi, S. Seo, 2006 .

Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM

Hyuck-Mo Lee, S. Seo, M. Cho, 2008 .

Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures

Sun-Kyoung Seo, Hyuck-Mo Lee, Hyuck Mo Lee, 2009 .

Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging

Sung K. Kang, Hyuck-Mo Lee, D. Shih, 2009 .

Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate

Hyuck-Mo Lee, Inyu Jung, M. Cho, 2009 .

Wettability and interfacial reactions of Sn-based Pb-free solders with Cu–xZn alloy under bump metallurgies

Hyuck-Mo Lee, S. Seo, M. Cho, 2009 .

Undercooling and microhardness of Pb-free solders on various under bump metallurgies

Sung K. Kang, Hyuck-Mo Lee, M. Cho, 2008 .

Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders

Sung K. Kang, Hyuck-Mo Lee, Jaewon Chang, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Effect of Ag Addition on the Ripening Growth of ${\rm Cu}_{6}{\rm Sn}_{5}$ Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

Kyung-Wook Paik, Sun-Kyoung Seo, Hyuck-Mo Lee, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effect of Ag on ripening growth of Cu6Sn5 grains formed between molten Sn-xAg-0.5Cu solders and Cu

Hyuck-Mo Lee, K. Paik, Y. Park, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Development of low temperature bonding using in-based solders

Hyuck-Mo Lee, S. Yoon, J. Lau, 2008, 2008 58th Electronic Components and Technology Conference.

Critical Factors Affecting the Undercooling of Pb-free, Flip-Chip Solder Bumps and In-situ Observation of Solidification Process

Da-Yuan Shih, P. Lauro, D. Shih, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Optimization of Ag Composition in Cu Pillar Bumps with Sn-xAg Solders

Sun-Hee Park, E. Ahn, M. Cho, 2012 .

Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints

Sun-Kyoung Seo, Hyuck-Mo Lee, Hyuck Mo Lee, 2010 .

The Microstructure and Crystal Orientation of SnAg and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni ( P )

Sung K. Kang, Hyuck-Mo Lee, D. Shih, 2009 .