B. Czerny

Comparative study of wire bond degradation under power and mechanical accelerated tests

F. Iannuzzo, H. Luo, G. Khatibi, 2019, Journal of Materials Science: Materials in Electronics.

Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic Loading

J. Nicolics, M. Lederer, G. Khatibi, 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC).

Thermomechanical Reliability Investigation of Insulated Gate Bipolar Transistor Module

Johann Nicolics, Golta Khatibi, Bernhard Czerny, 2018, 2018 41st International Spring Seminar on Electronics Technology (ISSE).

Step-by-Step Building of a Four Dimensional Fatigue Compatible Regression Model including Frequencies

A. Fernández‐Canteli, S. Blasón, G. Khatibi, 2021, Open Journal of Statistics.

Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions

M. Thoben, Golta Khatibi, Bernhard Czerny, 2012, Microelectron. Reliab..

Reliability of Cu wire bonds in microelectronic packages

Johann Nicolics, Golta Khatibi, Bernhard Czerny, 2017, Microelectron. Reliab..

Simulation of stress concentrations in wire-bonds using a novel strain gradient theory

M. Lederer, G. Khatibi, M. Thoben, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl

Golta Khatibi, Bernhard Czerny, G. Khatibi, 2018, Microelectron. Reliab..

Accelerated mechanical fatigue interconnect testing method for electrical wire bonds

G. Khatibi, B. Czerny, 2018 .

Interface reliability and lifetime prediction of heavy aluminum wire bonds

Golta Khatibi, Bernhard Czerny, G. Khatibi, 2016, Microelectron. Reliab..

Fatigue testing method for fine bond wires in an LQFP package

Golta Khatibi, Bernhard Czerny, A. Mazloum-Nejadari, 2016, Microelectron. Reliab..

Influence of wirebond shape on its lifetime with application to frame connections

M. Thoben, B. Czerny, G. Khatibi, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Effect of the loop forming process on the lifetime of aluminum heavy wire bonds under accelerated mechanical testing

G. Khatibi, B. Czerny, T. Döhler, 2024, Microelectronics Reliability.