T. Hu

Selective copper metallization by electrochemical contact displacement with amorphous silicon film

B. Dai, M. Feng, M. Tsai, 2001 .

Preparation of low leakage current fluorine-doped silicon-oxycarbide by PECVD

Ying-Lang Wang, Jow-Lay Huang, Y. Juang, 2008 .

Nitric acid-based slurry with citric acid as an inhibitor for copper chemical mechanical polishing

S. Chiu, M. Feng, I. Tung, 1999 .

Controlled electrode magnetization alignment in planar elliptical ferromagnetic break junction devices

G. Scott, T. Hu, 2016, 1610.08880.