Chih-chi Chen

发表

Microstructural evolution of diamond/Si(100) interfaces with pretreatments in chemical vapor deposition

Fu-Rong Chen, T. Lin, Tzer-Shen Lin, 1995 .

Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250°C

Sinn-wen Chen, Chih-chi Chen, 2007 .

Nickel and copper deposition on Al2O3 and SiC particulates by using the chemical vapour deposition–fluidized bed reactor technique

Sinn-wen Chen, Chih-chi Chen, 1997 .

Interfacial reactions in Sn–Sb/Ni couples

Yue-ting Chen, Chih-chi Chen, 2012 .

Phase Equilibria of the Sn-Sb Binary System

Sinn-wen Chen, Hsin-jay Wu, Chih-chi Chen, 2008 .

Phase transformation and microstructural evolution in solder joints

Sinn-wen Chen, Chao-hong Wang, S. Lin, 2007 .

The Isothermal Section of the Sn-Sb-Ni Ternary System at 270°C

Yue-ting Chen, Chih-chi Chen, G. Fang, 2014, Journal of Electronic Materials.

Sn/Ni–Co solid/solid interfacial reactions

Chih-chi Chen, Ya-ting Chan, 2008 .

Phase Equilibria of the Sn-V System and Interfacial Reactions in Sn/V Couples

Sinn-wen Chen, Chih-chi Chen, W. Gierlotka, 2008 .

Alternating reaction phases in Sn-Cu/Ni-Co solid-state reactions

Yue-ting Chen, Chih-chi Chen, 2012 .

Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C

Yue-ting Chen, Chih-chi Chen, Ya-ting Chan, 2010 .

Electromigration effects upon the Sn∕Ni–7wt%V interfacial reactions

Sinn-wen Chen, Chih-horng Chang, Chih-chi Chen, 2008 .

Co Effects upon Intermetallics Growth Kinetics in Sn-Cu-Co/Ni and Sn-Cu-Co/Cu Couples

Chih-chi Chen, Ya-chun Chang, Y. Tseng, 2014, Journal of Electronic Materials.

Wettability and interfacial reactions between the molten Sn–3.0 wt%Ag–0.5 wt%Cu solder (SAC305) and Ni–Co alloys

Yue-ting Chen, Chih-chi Chen, Ya-ting Chan, 2010 .

Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) Couples

Sinn-wen Chen, Yi-Hsiang Chao, Chih-chi Chen, 2008 .

The 600 °C isothermal section of the Sn–Ni–V ternary system

Chih-chi Chen, Ya-ting Chan, Yuanzhen Liang, 2014 .

Investigations of wetting properties of Ni–V and Ni–Co alloys by Sn, Sn–Pb, Sn–Cu, and Sn–Ag–Cu solders

Chun-Chong Fu, Chih-chi Chen, Chih-chi Chen, 2011 .

Characterization of the ternary phase at the Sn/Ni–V joint

Sinn-wen Chen, Chih-horng Chang, Chih-chi Chen, 2008 .

Interfacial reactions in Sn/Ni–7 wt.%V couple

Sinn-wen Chen, Chih-horng Chang, Chih-chi Chen, 2007 .

The Sn/Ni-7Wt.%V interfacial reactions

Sinn-wen Chen, Chih-chi Chen, 2006 .

Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-Rich corner

Sinn-wen Chen, Chih-chi Chen, Ching-Ya Kao, 2006 .

Sn-Zn/Ni-Co Interfacial Reactions at 250°C

Hsin-fu Lin, Chih-chi Chen, Ya-chun Chang, 2014, Journal of Electronic Materials.

Cross-Interaction in Cu/Sn/Co/Sn/Ni and Cu/Sn–Co/Co/Sn– Co/Ni Couples

Chih-chi Chen, Y. Tseng, 2015, Journal of Electronic Materials.

Solid state interfacial reactions in SAC305/Ni-Co couples

Yue-ting Chen, Chih-chi Chen, Ya-ting Chan, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

Solid/solid interfacial reactions between Sn–0.7 wt% Cu and Ni–7 wt% V

Sinn-wen Chen, Chih-horng Chang, Chih-chi Chen, 2008 .

Phase Equilibria of the Sn–Ni–Si Ternary System and Interfacial Reactions in Sn–(Cu)/Ni–Si Couples

Chih-chi Chen, G. Fang, 2015, Journal of Electronic Materials.

Formation of a Metastable Phase at the Interface Between Sn and Ag–Pd Substrates During Liquid-State Reaction

Hsin-fu Lin, Chih-chi Chen, 2014, Journal of Electronic Materials.

Phase equlibria studies of the Sn-Sb-Ni system at 270°C

Yue-ting Chen, Chih-chi Chen, 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.