Tang-Yuan Chen
发表
Ming-Hung Chen,
M. Shih,
C. Kao,
2016,
2016 International Conference on Electronics Packaging (ICEP).
Chiun-Hsun Chen,
Tang-Yuan Chen,
C. Cheng,
2012
.
M. Shih,
S. Jian,
Y. Chiu,
2017,
2017 IEEE CPMT Symposium Japan (ICSJ).
Yi-Chu Hsu,
Tang-Yuan Chen,
Y. Hsu,
2007,
Biomedical microdevices.
Chih-Pin Hung,
Jin-Yuan Lai,
Meng-Kai Shih,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Yu-Hsiang Chang,
C. Kao,
H. Chien,
2023,
Applied Thermal Engineering.
Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package
T. Chiu,
M. Shih,
Dao-Long Chen,
2019,
Impact.
Wei-Jie Yin,
C. Kao,
W. Lai,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Tang-Yuan Chen,
Bing-Yuan Huang,
2020,
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
C. Kao,
W. Lai,
Dao-Long Chen,
2022,
Electronic Components and Technology Conference.
T. Chiu,
Wei-Jie Yin,
C. Kao,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
M. Shih,
Ying-Chih Lee,
D. Tarng,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Jin-Yuan Lai,
Tang-Yuan Chen,
Bo-Syun Chen,
2016,
2016 IEEE CPMT Symposium Japan (ICSJ).
Kuo-Shen Chen,
Ching-Jenq Ho,
C. Kao,
2023,
2023 International Conference on Electronics Packaging (ICEP).