Sheng-Hsiung Shih

Singular Uniformity after Reflow of Varied-Shaped Flip Chip Solder Bump on Single Substrate

Jung-Tang Huang, Sheng-Hsiung Shih, Chan-Shoue Wu, 2006, 2006 International Conference on Electronic Materials and Packaging.

A novel polishing mechanism used in manufacturing ultra-high uniformity gold solder bump

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2005, 2005 7th Electronic Packaging Technology Conference.

Combination of Fine Pitch and High Uniformity of Lead-Free Plating-Based Flip Chip Solder Bumps

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2006, 2006 International Conference on Electronic Materials and Packaging.

DEP-base particle counting device

Jung-Tang Huang, S. Cheng, Sheng-Hsiung Shih, 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

Jung-Tang Huang, Sheng-Hsiung Shih, Hou-Jun Hsu, 2007 .

Using an Innovative Polishing Process to Fabricate Ultra-High Uniformity of Polymer Surface

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2007, Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.

Surface modification on plating-based Cu/Sn/0.7Cu lead-free copper pillars by using polishing

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2008 .