C. Ehrhardt

Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling

R. Doring, S. Rzepka, R. Dudek, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)

Klaus-Dieter Lang, Christian Ehrhardt, Matthias Hutter, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures

A. Mavinkurve, Roland Fiederling, H. Willwohl, 2013 .

Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects

R. Dudek, S. Rzepka, M. Hutter, 2015, 2015 European Microelectronics Packaging Conference (EMPC).

The reliability of wire bonding using Ag and Al

Christian Ehrhardt, Martin Schneider-Ramelow, M. Schneider-Ramelow, 2016, Microelectron. Reliab..