X. Bai

Finite element analysis of influence of passivation layer on Cu/low-k structure during thermosonic Cu wire bonding

D. Du, B. Chang, X. Bai, 2014 .

Influences of material and structural factors on the stress conditions in Cu/low-k chips during Cu wire bonding

D. Du, B. Chang, X. Bai, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Numerical study on porosity distribution in casting under micro- amplitude vibration condition

X. Bai, K. You, T. Miao, 2020, IOP Conference Series: Materials Science and Engineering.

Distribution of Al in Al–Si Alloys during electromagnetic continuous casting with cylindrical open ended crucible

Y. Li, Zhijian Peng, Jiang Li, 2015 .