K. Mirpuri

Behavior of (111) grains during the thermal treatment of copper film studied in situ by electron back-scatter diffraction

H. Wendrock, J. Szpunar, K. Wetzig, 2006 .

Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction

S. Menzel, H. Wendrock, J. Szpunar, 2006 .

Correlation of electromigration defects in small damascene Cu interconnects with their microstructure

Klaus Wetzig, Horst Wendrock, Siegfried Menzel, 2005 .

Influence of substrate on high-temperature behavior of copper film studied in situ by electron backscatter diffraction

J. Szpunar, K. Mirpuri, 2005 .

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

N. Chawla, D. Friedman, H. Xie, 2013, Journal of Electronic Materials.

Texture investigation of copper interconnects with a different line width

J. Szpunar, D. N. Lee, J. An, 2005 .