D. Luo

Present status of Sn–Zn lead-free solders bearing alloying elements

S. Xue, P. Xue, Shuang Liu, 2015, Journal of Materials Science: Materials in Electronics.

A Tifsix Pillared Mof  With Unprecedented Zsd Topology for Efficient Separation of Acetylene from Quaternary Mixtures

Yongqi Hu, Jianbo Hu, Huabin Xing, 2022, SSRN Electronic Journal.

Influence of damascene trenches on grain growth and electromigration behavior of ULSI Cu lines

X. Wang, Y. Xia, Y. Ji, 2004, 2004 24th International Conference on Microelectronics (IEEE Cat. No.04TH8716).

Grain structure and crystallographic orientation in Cu damascene lines

Xiao-Dong Wang, Yangyang Xia, D. Luo, 2004 .

Scanning thermal microscopy studies of local temperature distribution of micron-sized metallization lines

Dong Wang, Yuan Ji, Dong Luo, 2001, Microelectron. Reliab..

Effects of Ga addition on microstructure and properties of Sn–0.5Ag–0.7Cu solder

S. Xue, D. Luo, Zai-qian Li, 2014, Journal of Materials Science: Materials in Electronics.

Investigation on the intermetallic compound layer growth of Sn–0.5Ag–0.7Cu–xGa/Cu solder joints during isothermal aging

S. Xue, Shuang Liu, D. Luo, 2014, Journal of Materials Science: Materials in Electronics.