Tien-Lin Lu

Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition

Chih Chen, Yu Shen, John A. Wu, 2019, Materials.

Electromigration failure mechanisms of 〈1 1 1〉 -oriented nanotwinned Cu redistribution lines with polyimide capping

K. Tu, Chih Chen, Po-Ning Hsu, 2021 .

Fabrication and Characterization of ⟨100⟩-Oriented Quasi-single Crystalline Cu Lines

John A. Wu, Chih Chen, Tien-Lin Lu, 2020 .

Extremely anisotropic single-crystal growth in nanotwinned copper

K. Tu, Chia-ling Lu, J. Kuo, 2014 .

Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

K. Tu, Chia-ling Lu, J. Kuo, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).