Junde Wang

Hermetic packaging of Kovar alloy and low-carbon steel structure in hybrid integrated circuit (HIC) system using parallel seam welding process

Yunfei En, Xiaoqi He, Xinping Zhang, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Effect of Initial Grain Size on the Dynamic Recrystallization of Hot Deformation for 3003 Aluminum Alloy

G. Fu, Guiqing Chen, Junde Wang, 2018, Metals and Materials International.

Application of BIM Technology in Building Water Supply and Drainage Design

Wei Tianyun, Guiqing Chen, Wang Junde, 2017, Foreign Language Science and Technology Journal Database Engineering Technology.