Jing-yu Fan
发表
Zhuo Li,
Dao-zeng Wang,
Shiyi Lu,
2016
.
H. Zhu,
Peng Cheng,
B. Zhong,
2015
.
Min-rui Fei,
H. Zhu,
Peng Cheng,
2013
.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2011
.
J. Liu,
Yan Zhang,
Jing-yu Fan,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2006,
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
Yan Zhang,
Shun Wang,
Jing-yu Fan,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Yan Zhang,
Jing-yu Fan,
Pingping Zhou,
2015,
Journal of Inorganic and Organometallic Polymers and Materials.
Yan Zhang,
Jing-yu Fan,
Na Liu,
2020
.
Xiao-yan He,
Dao-zeng Wang,
Jing-yu Fan,
2013
.
Dao-zeng Wang,
Jing-yu Fan,
Kun Zhang,
2010
.
Yan Zhang,
Dao-zeng Wang,
Jing-yu Fan,
2003
.
Yan Zhang,
Jing-yu Fan,
Ling Chen,
2020
.
M. Inoue,
Johan Liu,
Yan Zhang,
2011
.
J. Liu,
Z. Cheng,
Yan Zhang,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
Dao-zeng Wang,
Jing-yu Fan,
2014
.
Yan Zhang,
Jing-yu Fan,
2009
.
Johan Liu,
R. Larsson,
Z. Cheng,
2006,
Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..
Johan Liu,
R. Larsson,
Yan Zhang,
2007
.
Johan Liu,
Yan Zhang,
Jing-yu Fan,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Johan Liu,
R. Larsson,
Yan Zhang,
2006,
2006 1st Electronic Systemintegration Technology Conference.
Johan Liu,
Yan Zhang,
Shun Wang,
2010,
3rd Electronics System Integration Technology Conference ESTC.
Yan Zhang,
Jing-yu Fan,
2020
.
Yan Zhang,
Dao-zeng Wang,
Jing-yu Fan,
2009
.
Experimental study on electrical properties and stability of CNT bumps in high density interconnects
Johan Liu,
Yifeng Fu,
Ying Zhou,
2013,
2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013).
Johan Liu,
Yifeng Fu,
Yong Zhang,
2014,
2014 15th International Conference on Electronic Packaging Technology.
J. Liu,
R. Larsson,
Z. Cheng,
2005,
International Conference on Polymers and Adhesives in Microelectronics and Photonics.
Yan Zhang,
Jing-yu Fan,
Johan Liu,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Dao-zeng Wang,
Jing-yu Fan,
Song L. Xu,
2010
.