J. Ahn

发表

Evaluation of the flexibility of silver circuits screen-printed on polyimide with an environmental reliability test.

S. Jung, Kwang-Seok Kim, Young-Chul Lee, 2011, Journal of nanoscience and nanotechnology.

Microstructural Characterization of Cold-Drawn Cu-Ni-Si Alloy Having High Strength and High Conductivity

Miyoung Kim, H. Baik, Seung-Zeon Han, 2019, Journal of Alloys and Compounds.

Effect of grain substructure refinement on tensile mechanical behavior of L21-strengthened Al-Cr-Fe-Ni-Ti-Mo high-entropy alloy

Young Kyun Kim, Y. Na, J. Won, 2022, Scripta Materialia.

The effect of heat treatment on flexibility of silver nanopaste circuit screen-printed on polyimide

Kwang-Seok Kim, Young-Chul Lee, J. Ahn, 2010, 2010 IEEE Nanotechnology Materials and Devices Conference.

Effect of carbon addition on the passivity of hypoeutectic high chromium cast irons

Je-hyun Lee, Jun-Hyeong Lee, Seung-Zeon Han, 2022, RSC advances.

Properties of nanocrystalline CuAg foil prepared via electrodeposition

K. Lee, Young-Bae Park, Seunghoe Choe, 2021 .

Effect of Prior Cold Working before Aging on the Precipitation Behavior in a Cu-3.5 wt% Ti Alloy

Je-hyun Lee, K. Kim, S. Semboshi, 2019, Korean Journal of Metals and Materials.

The effect of bimodal structure with nanofibers and normal precipitates on the mechanical and electrical properties of Cu Ni Si alloy

Je-hyun Lee, Kwangho Kim, Sung-Hwan Lim, 2020 .

Effect of inclusion on strength and conductivity of Cu-Ni-Si alloys with discontinuous precipitation

Je-hyun Lee, X. Mi, Sangshik Kim, 2020 .

Effect of pre-deformation before aging on discontinuous precipitation behaviour in Cu-Ni-Si alloys

Je-hyun Lee, X. Mi, Guojie Huang, 2020 .

MICROSTRUCTURE AND FATIGUE PROPERTIES OF CU–NI–SI ALLOY STRENGTHENED BY NI2SI INTERMETALLIC COMPOUNDS

M. Goto, Takaei Yamamoto, J. Ahn, 2021, Computational Methods and Experimental Measurements XX.

Discontinuous precipitation at the deformation band in copper alloy

M. Goto, Je-hyun Lee, K. Kim, 2018, Metals and Materials International.

Optimization of conductivity and strength in Cu-Ni-Si alloys by suppressing discontinuous precipitation

Je-hyun Lee, Sung-Hwan Lim, K. Kim, 2016, Metals and Materials International.

Increasing toughness by promoting discontinuous precipitation in Cu–Ni–Si alloys

M. Goto, Je-hyun Lee, Sung-Hwan Lim, 2016 .

Effect of Pre-Aging Treatment on the Mechanical Properties of Cold Rolled Cu-6 wt% Ni-1.4 wt% Si Alloy

Je-hyun Lee, Y. Choi, Sangshik Kim, 2020 .

Grain growth in ultrafine grain sized copper during cyclic deformation

M. Goto, Je-hyun Lee, Sung-Hwan Lim, 2014 .

Design of exceptionally strong and conductive Cu alloys beyond the conventional speculation via the interfacial energy-controlled dispersion of γ-Al2O3 nanoparticles

Byungchan Han, Sang Min Kim, Jehyun Lee, 2015, Scientific Reports.

S-N Property and Fatigue Damage of Ultrafine Grained Cu Smooth Specimens☆

M. Goto, Sangshik Kim, J. Ahn, 2014 .

RELATIONSHIP BETWEEN SHEAR PLANE OF THE FINAL PRESSING AND FATIGUE CRACK GROWTH BEHAVIOUR OF ROUND-BAR SPECIMENS OF CU PROCESSED BY ECAP

M. Goto, Kusno Kamil, Sangshik Kim, 2017 .

BEHAVIOUR OF SMALL FATIGUE CRACKS IN CU-5.5NI-1.28SI ALLOY ROUND-BAR SPECIMENS

M. Goto, Je-hyun Lee, Takaei Yamamoto, 2019, Computational Methods and Experimental Measurements XIX.

Enhancement of strength and electrical conductivity for hypo-eutectic Cu-12Ag alloy

Sung-Hwan Lim, Seunghoe Choe, Eun-Ae Choi, 2022, Journal of Alloys and Compounds.

Accelerating heterogeneous nucleation to increase hardness and electrical conductivity by deformation prior to ageing for Cu-4 at.% Ti alloy

Je-hyun Lee, Kwangho Kim, S. Semboshi, 2019, Philosophical Magazine Letters.

Co and Ti effect on hot workability of phosphor bronze

Sangshik Kim, Eun-Ae Choi, Jehyung Lee, 2022, Journal of Alloys and Compounds.

Ti-added alumina dispersion-strengthened Cu alloy fabricated by oxidation

Je-hyun Lee, Sung-Hwan Lim, H. Joh, 2015 .

Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching

S. Jung, Kwang-Seok Kim, C. Yoo, 2010 .

Crack growth rate of inclined and deflected surface-cracks in round-bar specimens of copper processed by equal channel angular pressing under cyclic loading

J. H. Lee, M. Goto, Je-hyun Lee, 2017 .

Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test

S. Jung, Y. Shin, Jeong-Won Yoon, 2012, Journal of Materials Science: Materials in Electronics.

Regulation in Shear Test Method for BGA of Flip-chip Packages

S. Jung, Kwang-Seok Kim, Yong Il Kim, 2010 .

Simultaneous increase in electrical conductivity and fatigue strength of Cu-Ni-Si alloy by utilizing discontinuous precipitates

M. Goto, T. Utsunomiya, S. Lim, 2021 .

Simultaneous increase in strength and ductility by decreasing interface energy between Zn and Al phases in cast Al-Zn-Cu alloy

Je-hyun Lee, Kwangho Kim, Sung-Hwan Lim, 2017, Scientific Reports.

Stress-dependent opening- and shear-mode propagation behavior of fatigue cracks in ultrafine-grained Cu fabricated by equal channel angular pressing

M. Goto, T. Utsunomiya, J. Ahn, 2021 .

Fatigue-induced damage and crack growth of Cu processed by ECAP

M. Goto, Sangshik Kim, J. Ahn, 2015 .

Effect of sintering temperature on electrical characteristics of screen-printed Ag nanopaste on FR4 substrate.

Kwang-Seok Kim, Jeong-Won Yoon, Jong-Woong Kim, 2011, Journal of nanoscience and nanotechnology.

Enhancing bonding strength between Cu and Cu2O through crystallographic orientation variation

J. Yun, J. Ahn, Seung Zeon Han, 2024, Journal of Alloys and Compounds.