Jayhoon Chung

Strapped Cu interconnect for enhancing electromigration limit for power device application

S. Krishnan, J. Joh, Young-Joon Park, 2020, 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).

Comparison of convergent beam electron diffraction and geometric phase analysis for strain measurement in a strained silicon device

D. Diercks, G. Lian, Jayhoon Chung, 2011, Journal of microscopy.

Two-dimensional imaging of the potential distribution within a core/shell nanowire by electron holography

Jayhoon Chung, L. Rabenberg, J. Chung, 2006 .

Electromigration current limit relaxation for power device interconnects

S. Krishnan, J. Joh, Young-Joon Park, 2018, 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD).

Mapping of electrostatic potentials within core-shell nanowires by electron holography

Jayhoon Chung, L. Rabenberg, J. Chung, 2006 .