J. Kaaos

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

M. Paulasto-Kröckel, Hongqun Dong, V. Vuorinen, 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).

Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

M. Paulasto-Kröckel, V. Vuorinen, G. Ross, 2020, Journal of Electronic Materials.

Aluminum Nitride to Silicon Direct Bonding for an Alternative Silicon-On-Insulator Platform

M. Paulasto-Kröckel, G. Ross, J. Kaaos, 2021, ACS applied materials & interfaces.