W. Kanert
发表
G. Wachutka,
G. Groos,
A. I. Deckelmann,
2001
.
C. S. Tan,
Jiawei Marvin Chan,
W. Kanert,
2017,
2017 IEEE International Reliability Physics Symposium (IRPS).
R. Pufall,
W. Kanert,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
C. S. Tan,
Jiawei Marvin Chan,
W. Kanert,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Michael Goroll,
Reinhard Pufall,
Rainer Dudek,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
W. Kanert,
R. Pufall,
R. Dudek,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Werner Kanert,
W. Kanert,
2009,
2009 IEEE International Reliability Physics Symposium.
M. Stecher,
M. Pfost,
T. Smorodin,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
B. Michel,
R. Dudek,
S. Rzepka,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.