T. Voß

Accurate Depth Control of Through-Silicon Vias by Substrate Integrated Etch Stop Layers

M. Kaynak, M. Wietstruck, S. Marschmeyer, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Development of a Through-Silicon Via (TSV) Process Module for Multi-project Wafer SiGe BiCMOS and Silicon Interposer

M. Kaynak, D. Wolansky, M. Wietstruck, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Terahertz subwavelength sensing with bio-functionalized germanium fano-resonators

G. Capellini, B. Witzigmann, J. Piehler, 2022, Frequenz.

BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications

A. Pothier, M. Kaynak, C. Palego, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technology

M. Kaynak, D. Wolansky, A. Göritz, 2017, 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).

Gain enhancement of BiCMOS on-chip sub-THz antennas by mean of meta-cells

M. Kaynak, T. Zwick, D. Mencarelli, 2022, Scientific Reports.