M. Heschel

Longevity of the novel ConvaTec infusion set with Lantern technology

B. Buckingham, R. Lal, Liana J. Hsu, 2021, Diabetes, obesity & metabolism.

Solid state silicon based condenser microphone for hearing aid, has transducer chip and IC chip between intermediate chip and openings on both sides of intermediate chip, to allow sound towards diaphragm

Ole Hansen, Matthias Müllenborn, Pirmin Hermann Otto Rombach, 2000 .

Advances in Insulin Pump Infusion Sets Symposium Report

D. Klonoff, R. Vigersky, B. Buckingham, 2021, Journal of diabetes science and technology.

Survival assessment of the extended‐wear insulin infusion set featuring lantern technology in adults with type 1 diabetes by the glucose clamp technique

T. Pieber, J. Mader, A. Groselj‐Strele, 2021, Diabetes, obesity & metabolism.

Using Insulin Infusion Sets in CSII for Longer Than the Recommended Usage Time Leads to a High Risk for Adverse Events

D. Klonoff, A. Pfützner, M. Grenningloh, 2015, Journal of diabetes science and technology.

Insulin distribution in human adipose tissue via a novel insulin infusion catheter.

F. Sinner, T. Birngruber, M. Heschel, 2019, Diabetes technology & therapeutics.

Application and RF performance of integrated resistor structures on non-planar topologies in micro-machined silicon packages for transmitter optical subassemblies

S. Weichel, R. Hauffe, P. Runge, 2006, 56th Electronic Components and Technology Conference 2006.

127-LB: Longevity of the Coated ConvaTec Infusion Set with Lantern Technology

B. Buckingham, R. Lal, Liana J. Hsu, 2019, Diabetes.

Stacking Technology for a Space Constrained Microsystem

Jochen Kuhmann, Matthias Heschel, Siebe Bouwstra, 1998, Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176.

Flip-Chip Hermetic Packaging for MEMS

E. H. Pedersen, M. Heschel, P. Rombach, 2000 .

Automated assembly and packaging of hybrid optical modules

G. Eiger, M. Heschel, L. Shiv, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon

M. Heschel, Siebe Bouwstra, 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

Batch fabrication of through-wafer vias in CMOS wafers for 3-D packaging applications

O. Hansen, F. E. Rasmussen, M. Heschel, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..