Xiangbin Du

Experimental investigation of the embedded microchannel manifold cooling for power chips

Z. Duan, Binbin Jiao, Ruiwen Liu, 2021, Thermal Science.

Investigation on the heat dissipation of high heat flux chip array by fractal microchannel networks

Binbin Jiao, Ruiwen Liu, Lihang Yu, 2022, Thermal Science.

A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control

Binbin Jiao, Ruiwen Liu, Lihang Yu, 2022, Applied Thermal Engineering.

Embedded cooling method with configurability and replaceability for multi-chip electronic devices

N. Zhang, Binbin Jiao, K. Jia, 2022, Energy Conversion and Management.

Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation

Binbin Jiao, Yanmei Kong, Nan Zhang, 2021 .

Embedded manifold cooling system for high performance computing ICs

Binbin Jiao, Ruiwen Liu, Lihang Yu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Investigation on the unconstrained microfluidic heat sink with high anti-blockage capacity for multiple hotspots system

Binbin Jiao, Ruiwen Liu, Lihang Yu, 2023, Thermal Science.