Shuhui Chen

Application of electrodeposited Cu-metal nanoflake structures as 3D current collector in lithium-metal batteries

Yunwen Wu, T. Hang, Ming Li, 2022, Nanotechnology.

The Influence of Leveler on the Impurity Behavior of Electroplated Cu Films During Laser Annealing

Yunwen Wu, T. Hang, Huiqin Ling, 2021, Journal of The Electrochemical Society.

Impurity diffusion behavior study of electroplated copper films annealed by linear shaping laser mobile scanning system

Yunwen Wu, T. Hang, Huiqin Ling, 2021 .

Effects of amorphous Co W and Ni W barrier layers on the evolution of Sn/Cu interface

T. Hang, Huiqin Ling, Ming Li, 2021, Materials Characterization.

Effects of W contents on the solid-state interfacial reactions of Sn/Co-W

Yunwen Wu, T. Hang, Huiqin Ling, 2022, Journal of Materials Science.

Growth behavior and mechanism of tin whisker on isolated SnAg solder under compressive stress

T. Hang, Huiqin Ling, Ming Li, 2021, 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).

The Evolution of Microstructure and Resistance in Electroplated Copper Films by Linear Integrated Laser Scanning Annealing

Yunwen Wu, T. Hang, Huiqin Ling, 2021, Electronic Materials Letters.