P. Milesi

Mechanical fatigue assessment of SAC305 solder joints under harmonic and random vibrations

L. Arnaud, O. Dalverny, J. Alexis, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling

Olivier Dalverny, J. B. Libot, Joël Alexis, 2018, Microelectron. Reliab..

Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations

J. B. Libot, L. Arnaud, P. Milesi, 2016, 2016 International Conference on Electronics Packaging (ICEP).

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

L. Arnaud, J. Alexis, P. Milesi, 2019, Journal of Electronic Packaging.

Experimental Strain Energy Density Dissipated in SAC305 Solder Joints During Different Thermal Cycling Conditions Using Strain Gages Measurements

L. Arnaud, O. Dalverny, J. Alexis, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Libot, Jean-Baptiste and Alexis, Joël and Arnaud, Lionel and Dalverny, Olivier and Milesi, Philippe and Dulondel, Frédéric Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling

L. Arnaud, O. Dalverny, P. Milesi, 2018 .