R. Rongen
发表
M. Soestbergen,
K. Jansen,
Guoqi Zhang,
2010
.
M. van Soestbergen,
G.Q. Zhang,
L. Ernst,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
M. van Soestbergen,
G.Q. Zhang,
L. Ernst,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
M. van Soestbergen,
G.Q. Zhang,
L. Ernst,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
R. Rongen,
G. Gubbels,
M. Kouters,
2010,
3rd Electronics System Integration Technology Conference ESTC.
P. M. Biesheuvel,
M. Soestbergen,
L. Ernst,
2008
.
Leon Goumans,
A. Mavinkurve,
G. M. O'Halloran,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
M. van Soestbergen,
A. Mavinkurve,
L. Goumans,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
M. van Soestbergen,
A. Mavinkurve,
L. Goumans,
2015,
2015 European Microelectronics Packaging Conference (EMPC).
J. Janssen,
A. Mavinkurve,
J. Zaal,
2014,
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Kirsten Weide-Zaage,
R. Roucou,
R. T. H. Rongen,
2014,
Microelectron. Reliab..
R. Rongen,
Kwei-Kuan Kuo,
2012,
2012 4th Electronic System-Integration Technology Conference.
R. T. H. Rongen,
A. van IJzerloo,
C. Cotofana,
2011,
Microelectron. Reliab..
M. van Soestbergen,
A. Mavinkurve,
J. Zaal,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
H. J. Bruggers,
R. Rongen,
I.M. Weijland-Emmerik,
2005,
2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..