R. Kulkarni

Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation

A. Zimmermann, M. Soltani, R. Kulkarni, 2020 .

Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds

T. Guenther, A. Zimmermann, S. Sahakalkan, 2021, Applied Mechanics.

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

Romit Kulkarni, Tobias Groezinger, Mahdi Soltani, 2019, IEEE Access.

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

T. Guenther, A. Zimmermann, M. Soltani, 2019, Journal of Manufacturing and Materials Processing.

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

Romit Kulkarni, Mahdi Soltani, Peter Wappler, 2020 .

Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices

Romit Kulkarni, Tobias Groezinger, André Zimmermann, 2018, Instruments.

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB

Romit Kulkarni, Tobias Groezinger, André Zimmermann, 2018, IEEE Access.

Experimental and computational study of array effects on LED thermal management on molded interconnect devices MID

Romit Kulkarni, Tobias Groezinger, André Zimmermann, 2018, 2018 13th International Congress Molded Interconnect Devices (MID).