J. Barnikow

发表

AU-SN SOLDER BUMPS WITH TUNGSTEN SILICIDE BASED BARRIER METALLIZATION SCHEMES

A. Klein, W. Pittroff, J. Würfl, 1995 .

Engineering Substrate Specificity of O6‐Alkylguanine‐DNA Alkyltransferase for Specific Protein Labeling in Living Cells

A. Juillerat, A. Terskikh, K. Johnsson, 2005, Chembiochem : a European journal of chemical biology.

Intrabody construction and expression. II. A synthetic catalytic Fv fragment.

J. Barnikow, E. Ohage, Boris Steipe, 1999, Journal of Molecular Biology.

Flip chip mounting of laser diodes with Au/Sn solder bumps: bumping, self-alignment and laser behavior

P. Kurpas, W. Pittroff, J. Wurfl, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.