Jianbiao Pan

发表

Drop impact reliability of edge-bonded lead-free chip scale packages

Jianbiao Pan, Dongkai Shangguan, Jasbir Bath, 2009, Microelectron. Reliab..

Optimization of engineering tolerance design using revised loss functions

Jianbiao Pan, Jeh-Nan Pan, 2009 .

Development and Assessment of a PCB Layout and Manufacturong Laboratory Module in Introductory Electric Circuits for EE and Non-EE Majors

Jianbiao Pan, James G. Harris, Albert Liddicoat, 2010 .

Finding and optimising the key factors for the multiple-response manufacturing process

Jianbiao Pan, Chun Yi Lee, Jeh-Nan Pan, 2009 .

The Effectiveness Analysis Of The Online Tools For Engineering Faculty Needs

Jianbiao Pan, Ismail Fidan, Leijun Li, 2005 .

Gauge Repeatability & Reproducibility Study for a 3-D Solder Paste Inspection System

Jianbiao Pan, Robert H. Storer, Gregory L. Tonkay, 1999 .

Reliability analysis of low-Ag BGA solder joints using four failure criteria

Jianbiao Pan, Erin Kimura, Jianbiao Pan, 2012 .

High-Resolution, Non-Contact Angular Measurement System for PSA/RSA

Jianbiao Pan, Ronald Sloat, 2011 .

Enhancing Student Learning Through State Of The Art Systems Level Design And Implementation: The Development Of A Lower Division Learning Module

Jianbiao Pan, James G. Harris, Dominic Dal Bello, 2008 .

A Study of Solder Joint Failure Criteria

Jianbiao Pan, Julie Silk, Jianbiao Pan, 2011 .

A Comparative Study of Various Loss Functions in the Economic Tolerance Design

Jianbiao Pan, Jeh-Nan Pan, 2006, 2006 IEEE International Conference on Management of Innovation and Technology.

AC 2008-2186: CURRICULAR ENHANCEMENT TO SUPPORT PROJECT-BASED LEARNING IN COMPUTER AND ELECTRICAL ENGINEERING

Jianbiao Pan, Albert Liddicoat, 2008 .

As originally published in the IPC APEX EXPO Conference Proceedings . A Control-Chart Based Method for Solder Joint Crack Detection

Jianbiao Pan, Jianbiao Pan, 2014 .

Curricular Enhancement to Support Project-Based Learning in Computer and Electrical Engineering

Jianbiao Pan, Lynne A. Slivovsky, James G. Harris, 2008 .

Effect of Gold Content on the Reliability of SnAgCu Solder Joints

Jianbiao Pan, Jianbiao Pan, M. Powers, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Drop test reliability of lead-free chip scale packages

Jianbiao Pan, J. Bath, Dongkai Shangguan, 2008, 2008 58th Electronic Components and Technology Conference.

Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP

Jianbiao Pan, Robert H. Storer, Gregory L. Tonkay, 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).