Devin E. Mix

Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesives

Avram Bar-Cohen, Devin E. Mix, 1993, Optics & Photonics.

Thermal Modeling of Plastic Ic Packages

Devin E. Mix, Avram Bar-Cohen, 1991 .

Influence of chip/encapsulant delamination on the thermo-structural behavior of a thermally-pulsed plastic IC package

Devin E. Mix, K. Tamma, A. Bar-Cohen, 1993 .